JPH01155633U - - Google Patents
Info
- Publication number
- JPH01155633U JPH01155633U JP5254788U JP5254788U JPH01155633U JP H01155633 U JPH01155633 U JP H01155633U JP 5254788 U JP5254788 U JP 5254788U JP 5254788 U JP5254788 U JP 5254788U JP H01155633 U JPH01155633 U JP H01155633U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- cover
- case
- circuit breaker
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
Landscapes
- Breakers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5254788U JPH01155633U (en]) | 1988-04-19 | 1988-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5254788U JPH01155633U (en]) | 1988-04-19 | 1988-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01155633U true JPH01155633U (en]) | 1989-10-25 |
Family
ID=31278553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5254788U Pending JPH01155633U (en]) | 1988-04-19 | 1988-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01155633U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7291910B2 (en) | 1990-09-24 | 2007-11-06 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
-
1988
- 1988-04-19 JP JP5254788U patent/JPH01155633U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7291910B2 (en) | 1990-09-24 | 2007-11-06 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |